Samsung uses heatpipes smartphones Galaxy S7 and Galaxy S7 edge-based SoC Snapdragon 820 – iXBT.com

Samsung has returned to the use of SoC Qualcomm Snapdragon announced in last week’s flagship smartphone Galaxy S7 and Galaxy S7 edge. Recall that the previous generation flagship Samsung has managed only proprietary SoC Exynos 7420, ignoring the Snapdragon 810 due to problems with overheating of the chip
 . In those devices that Snapdragon 810 yet appeared, indeed there was a reduction of clock frequency with resistive load. Producers have decided to deal with the overheating of drastic measures, including the use of heat pipes in the cooling systems of its smartphones.

 
 
 
 
 

Although the Galaxy S7 smartphones and Galaxy S7 edge used SoC Exynos 8890 and the Snapdragon 820, produced on the same 14-nanometer process technology, the Samsung still decided to play it safe in the latter case. In the model with Snapdragon 820 platform to cool the heat pipes will be used, while the version with the Exynos 8890 will do without them. According to the source, in the future the use of heat pipes in smart phones become commonplace, although at this stage of their suppliers are in no hurry to buy new molds for production. The reason is the short life cycle of smartphones and the need to develop the design of heat pipes individually for each model

Source:. Digitimes